The growth behavior of intermetallic compound layers of Sn-3Ag / Cu and Sn/Cu joints during soldering and aging

Author

Cheng, Cong-Qian ; Yang, Peng ; Zhao, Jie ; Zhu, Feng ; Song, Qing-Yang

Author_Institution

State Key Lab. of Mater. Modification by Laser,Io& Electron Beams, Dalian Univ. of Technol.

fYear

2006

fDate

27-28 June 2006

Firstpage

265

Lastpage

268

Abstract

The growth behaviors of Sn-3Ag/Cu and Sn/Cu IMC layers during soldering and aging have been investigated. In the soldering experiments, both the Sn-3Ag/Cu and Sn/Cu were soldered at 270 degC for different time. In the aging experiments, the Sn-3Ag/Cu and Sn/Cu joints were firstly soldered at 270 degC for 60s, and aged at 120 degC, 170 degC, 190 degC for various time. Then all the samples were observed under scanning electron microscopy (SEM). The average thickness of IMC layers was measured by using Q500IW image analysis meter. The results indicated that in the soldering the growth rate of Sn-3Ag/Cu IMC layers was faster than that of Sn/Cu. However, in the aging the growth rate of Sn-3Ag/Cu IMC layers was lower than that of Sn/Cu. The activation energies of Sn-3Ag/Cu and Sn/Cu IMC layers in the aging were about 90KJ/mol and 52KJ/mol respectively

Keywords

ageing; copper alloys; scanning electron microscopy; semiconductor growth; silver alloys; soldering; tin alloys; 120 C; 170 C; 190 C; 270 C; 60 s; Sn-Ag-Cu; Sn-Cu; aging; growth behavior; intermetallic compound layers; scanning electron microscopy; soldering; Aging; Environmentally friendly manufacturing techniques; Image analysis; Intermetallic; Materials science and technology; Morphology; Scanning electron microscopy; Soldering; Thickness measurement; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0488-6

Type

conf

DOI

10.1109/HDP.2006.1707604

Filename

1707604