DocumentCode :
2657570
Title :
Tin whisker growth under cycling current pulse
Author :
Jiang, Bo ; Xian, Ai-Ping
Author_Institution :
Inst. of Metal Res., Chinese Acad. of Sci., Shenyang
fYear :
2006
fDate :
27-28 June 2006
Firstpage :
280
Lastpage :
284
Abstract :
A new test method, called as cycling current pulse method, was developed to evaluate the trend of whisker growth, which the cycling current pulse was first applied for cyclical heating and cooling on the tin coating sample in order to accelerate the whisker growth. The loading current in samples was controlled by the device composed of alpha-simple applied controller and a constant current source, and the working current density varied from 5 times 104A/dm2 to 10 times 104A/dm2. It resulted in temperature of the samples varied from 40 degC to 75 degC, and both heating and cooling dwell time per cycle were 5 min, 0-2200 cycles (about 15 days) were carried out in present work. Tin whisker growth on surface finish is observed by SEM after different cycles; the results showed that the longest fluted whisker about 120 microns in length was observed after 2200 cycles current pulse test. As a comparison with the isothermal condition, there was a relative short incubation period in cycling current pulse test at current density 5 times 104A/dm2. However, at current density of 10 times 104A/dm2, whisker growth was slowdown, the reason is not clear now. Present work shows that the cycling current pulse method is effective to evaluate the trend of whisker growth
Keywords :
materials testing; surface finishing; whiskers (crystal); 120 microns; 40 to 75 C; 5 min; constant current source; cyclical cooling; cyclical heating; cycling current pulse test; isothermal condition; whisker growth; Coatings; Cooling; Current density; Heating; Isothermal processes; Life estimation; Surface finishing; Temperature; Testing; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0488-6
Type :
conf
DOI :
10.1109/HDP.2006.1707607
Filename :
1707607
Link To Document :
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