Title :
Embedded sensors for mechanical stress monitoring in copper damascene interconnects
Author :
Delamare, R. ; Kasbari, M. ; Rivero, Ch ; Blayac, S. ; Inal, K.
Author_Institution :
Centre de Microelectronique de Provence, Gardanne
Abstract :
A novel concept and related testing methodology of a sensing device is presented. This sensor is used to monitor the local intrinsic stresses induced in wafer processes. The main purpose of this abstract is to illustrate the power of the sensor as strain probe: the challenge is to correlate the electrical sensors signal directly to stress variation. This is demonstrated through an example where we propose to investigate the residual stress in the copper damascene lines.
Keywords :
copper; electric sensing devices; integrated circuit interconnections; integrated circuit measurement; internal stresses; strain sensors; stress measurement; wafer-scale integration; Cu; copper damascene interconnects; electrical sensors; embedded sensors; local intrinsic stresses; mechanical stress monitoring; residual stress; strain probe; wafer processes; Bridge circuits; Copper; Educational institutions; Mechanical sensors; Metals industry; Monitoring; Probes; Residual stresses; Resistors; Testing;
Conference_Titel :
Semiconductor Device Research Symposium, 2007 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-1892-3
Electronic_ISBN :
978-1-4244-1892-3
DOI :
10.1109/ISDRS.2007.4422311
