• DocumentCode
    2658101
  • Title

    A methodology for wafer scale integration of linear pipelined arrays

  • Author

    Ramaswamy, Ravi ; Brebner, Gavin ; Aspinall, D.

  • Author_Institution
    Dept. of Comput., Univ. of Manchester Inst. of Sci. & Technol., UK
  • fYear
    1990
  • fDate
    23-25 Jan 1990
  • Firstpage
    220
  • Lastpage
    228
  • Abstract
    A methodology for designing large one-dimensional pipelined array processing architectures where a large number of defects can be expected is presented. Central to the methodology is a functional separation at each processing element between the processing core and the inter-cell communication path. Using an `interconnection harness´ which provides the inter-cell communication medium and straps or links the underlying processing cores into a working array, 100% utilisation of the `healthy´ processing elements can be achieved. The harness which snakes across the wafer and forms the backbone of this architecture is made highly reliable and capable of sustaining up to a maximum of N single errors in an N cell array
  • Keywords
    VLSI; cellular arrays; fault tolerant computing; integrated circuit technology; microprocessor chips; pipeline processing; 100% utilisation; WSI; functional separation; inter-cell communication path; interconnection harness; large number of defects; linear pipelined arrays; one-dimensional pipelined array processing architectures; processing core; processing element; wafer scale integration; Array signal processing; Computer architecture; Design methodology; Fault tolerance; Logic arrays; Manufacturing processes; Multiplexing; Semiconductor device modeling; Testing; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1990. Proceedings., [2nd] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-9013-5
  • Type

    conf

  • DOI
    10.1109/ICWSI.1990.63904
  • Filename
    63904