DocumentCode
2658101
Title
A methodology for wafer scale integration of linear pipelined arrays
Author
Ramaswamy, Ravi ; Brebner, Gavin ; Aspinall, D.
Author_Institution
Dept. of Comput., Univ. of Manchester Inst. of Sci. & Technol., UK
fYear
1990
fDate
23-25 Jan 1990
Firstpage
220
Lastpage
228
Abstract
A methodology for designing large one-dimensional pipelined array processing architectures where a large number of defects can be expected is presented. Central to the methodology is a functional separation at each processing element between the processing core and the inter-cell communication path. Using an `interconnection harness´ which provides the inter-cell communication medium and straps or links the underlying processing cores into a working array, 100% utilisation of the `healthy´ processing elements can be achieved. The harness which snakes across the wafer and forms the backbone of this architecture is made highly reliable and capable of sustaining up to a maximum of N single errors in an N cell array
Keywords
VLSI; cellular arrays; fault tolerant computing; integrated circuit technology; microprocessor chips; pipeline processing; 100% utilisation; WSI; functional separation; inter-cell communication path; interconnection harness; large number of defects; linear pipelined arrays; one-dimensional pipelined array processing architectures; processing core; processing element; wafer scale integration; Array signal processing; Computer architecture; Design methodology; Fault tolerance; Logic arrays; Manufacturing processes; Multiplexing; Semiconductor device modeling; Testing; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1990. Proceedings., [2nd] International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-8186-9013-5
Type
conf
DOI
10.1109/ICWSI.1990.63904
Filename
63904
Link To Document