Title :
Three-dimensional nano electronics by dielectrophoretic assembly on a flexible substrate
Author :
Chen, Chia-Ling ; Chao, Shih-Hsien ; Selvarasah, Selvapraba ; Dokmeci, Mehmet R.
Author_Institution :
Northeastern Univ., Boston
Abstract :
In this paper, we demonstrate three-dimensional assembly of nanoscale materials, including single-walled and multi-walled carbon nanotubes and Au nanoparticles on a flexible parylene-C substrate. The assembly technology combines top down fabrication (fabrication of the three-dimensional microplatform) and bottom up dielectrophoretic (DEP) assembly of different nanomaterials.
Keywords :
carbon nanotubes; electrophoresis; flexible electronics; gold; nanoelectronics; nanoparticles; polymers; Au; dielectrophoretic assembly; flexible parylene-C substrate; multiwalled carbon nanotubes; nanoparticles; single-walled carbon nanotubes; three-dimensional nano electronics; three-dimensional nanoscale materials assembly; Assembly; Biosensors; Bridges; Dielectrophoresis; Electrodes; Fabrication; Gold; Nanobioscience; Nanoparticles; Nanostructured materials;
Conference_Titel :
Semiconductor Device Research Symposium, 2007 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-1892-3
Electronic_ISBN :
978-1-4244-1892-3
DOI :
10.1109/ISDRS.2007.4422332
