DocumentCode
2658127
Title
Chip-in-flex technology for flexible electronics applications
Author
Lewis, Jay ; Temple, Dorota
Author_Institution
RTI Int., Niles
fYear
2007
fDate
12-14 Dec. 2007
Firstpage
1
Lastpage
1
Abstract
We will discuss in detail the progress that has been made at RTI in developing chip-in-flex technologies, including specific applications such as sensors and implantable prostheses. We will discuss the advantages of this approach over traditional packaging techniques. We will also give an overview of related flexible electronics activities at RTI, including power, lighting, and sensor array technologies.
Keywords
chip scale packaging; flexible electronics; prosthetics; sensor arrays; RTI; chip-in-flex technology; flexible electronics; implantable prostheses; packaging; sensor array; Biological materials; Bonding; Consumer electronics; Costs; Displays; Educational institutions; Flexible electronics; Sensor arrays; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2007 International
Conference_Location
College Park, MD
Print_ISBN
978-1-4244-1892-3
Electronic_ISBN
978-1-4244-1892-3
Type
conf
DOI
10.1109/ISDRS.2007.4422333
Filename
4422333
Link To Document