Title :
Chip-in-flex technology for flexible electronics applications
Author :
Lewis, Jay ; Temple, Dorota
Author_Institution :
RTI Int., Niles
Abstract :
We will discuss in detail the progress that has been made at RTI in developing chip-in-flex technologies, including specific applications such as sensors and implantable prostheses. We will discuss the advantages of this approach over traditional packaging techniques. We will also give an overview of related flexible electronics activities at RTI, including power, lighting, and sensor array technologies.
Keywords :
chip scale packaging; flexible electronics; prosthetics; sensor arrays; RTI; chip-in-flex technology; flexible electronics; implantable prostheses; packaging; sensor array; Biological materials; Bonding; Consumer electronics; Costs; Displays; Educational institutions; Flexible electronics; Sensor arrays; Silicon; Substrates;
Conference_Titel :
Semiconductor Device Research Symposium, 2007 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-1892-3
Electronic_ISBN :
978-1-4244-1892-3
DOI :
10.1109/ISDRS.2007.4422333
