Title :
ISFET CMOS compatible design and encapsulation challenges
Author :
Sudakov-Boreysha, Liby ; Morgenshtein, Arkadiy ; Dinnar, Uri ; Nemirovsky, Yael
Author_Institution :
Dept. of Biomed. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
Abstract :
This work presents the main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.
Keywords :
CMOS integrated circuits; encapsulation; flip-chip devices; ion sensitive field effect transistors; semiconductor device packaging; ISFET CMOS compatible design; ISFET encapsulation; ISFET fabrication; SU8 encapsulant; flip-chip bonding packaging concept; Bonding; CMOS technology; Electrodes; Encapsulation; Fabrication; MOSFETs; Packaging; Sensor phenomena and characterization; Silicon; Threshold voltage;
Conference_Titel :
Electronics, Circuits and Systems, 2004. ICECS 2004. Proceedings of the 2004 11th IEEE International Conference on
Print_ISBN :
0-7803-8715-5
DOI :
10.1109/ICECS.2004.1399736
