DocumentCode :
2658378
Title :
Blending Six Sigma and CMMI - an approach to accelerate process improvement in SMEs
Author :
Habib, Maria ; Ahmed, Sana ; Rehmat, Amna ; Khan, Malik Jahan ; Shamail, Shafay
Author_Institution :
Dept. of Comput. Sci., LUMS, Lahore
fYear :
2008
fDate :
23-24 Dec. 2008
Firstpage :
386
Lastpage :
391
Abstract :
Significant software process improvement (SPI) of any kind requires a substantial investment of effort, time and money on part of organizations that try to follow it. SPI based on capability maturity model integration (CMMI) is no exception and adopting it is even more challenging for many small and medium enterprises (SMEs). However, it is becoming increasingly important for SMEs to get involved in SPI initiatives to gain imperative competitive advantage and survive in the software industry. In this paper, we explain how SMEs can adopt CMMI by first tailoring it to suit their requirements and then blending the cut-down version with Six Sigma´s define, measure, analyze, improve, and control (DMAIC) methodology to reduce the time required to attain CMMI maturity level 2 and 3. Moreover, we recommend standard templates and Six Sigma tools to maintain and control CMMI artifacts for different process areas (PAs). We show the effectiveness of our model by applying it on two PAs. Our proposed model is intended to accelerate CMMI adoption by SMEs and to help them compete better in the international market.
Keywords :
Capability Maturity Model; DP industry; six sigma (quality); small-to-medium enterprises; CMMI; SME; capability maturity model integration; define-measure-analyze-improve-and-control methodology; six sigma tools; small-and-medium enterprise; software process improvement; Acceleration; Application software; Computer industry; Six sigma; Software maintenance; Software quality; Software standards; Software systems; Software tools; Testing; Blended Model; CMMI; DMAIC; Process Area; Process Improvement; SMEs; Six Sigma;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multitopic Conference, 2008. INMIC 2008. IEEE International
Conference_Location :
Karachi
Print_ISBN :
978-1-4244-2823-6
Electronic_ISBN :
978-1-4244-2824-3
Type :
conf
DOI :
10.1109/INMIC.2008.4777768
Filename :
4777768
Link To Document :
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