DocumentCode
2659143
Title
Input-output insulation in thermal-piezoresisitive resonant microsctructures using embedded oxide beams
Author
Hajjam, Arash ; Rahafrooz, Amir ; Pourkamali, Siavash
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Denver, Denver, CO, USA
fYear
2012
fDate
21-24 May 2012
Firstpage
1
Lastpage
4
Abstract
This paper reports on the design, fabrication and testing of silicon based monolithic thermally actuated MEMS resonators with electrically insulated input and output ports. Promising results lately achieved for thermally actuated micromechanical resonators show that they could be viable candidates for frequency referencing and sensory applications. However, most of such devices utilizing monolithic fully silicon structures demonstrated so far use the same elements as both thermal actuators and piezoresistive sensors simultaneously. This leads to significantly high transmission feedthrough necessitating post-measurement data processing and de-embedding the effect of the large feedthrough conductance in order to extract the pure resonance behavior. The large feedthrough also complicates using such devices as frequency selective electronic components. The presented approach in this work takes advantage of embedded silicon oxide beams in the resonator structure formed through a long thermal oxidation process. The oxide beams electrically isolate the input and output ports of the resonator while maintaining its mechanical integrity. Characterization of resonators fabricated using this technique shows significantly suppressed feedthrough levels in the measured transmission data.
Keywords
elemental semiconductors; microactuators; microfabrication; micromechanical resonators; piezoelectric actuators; piezoelectric transducers; piezoresistive devices; silicon; thermal insulation; Si; electrically insulated input-output ports; embedded silicon oxide beams; feedthrough conductance; frequency selective electronic components; input-output insulation; long thermal oxidation process; mechanical integrity; monolithic fully silicon structures; piezoresistive sensors; post-measurement data processing; silicon based monolithic thermally actuated MEMS resonators; thermal-piezoresisitive resonant microsctructures; thermally actuated micromechanical resonators; transmission feedthrough; Fabrication; Frequency measurement; Micromechanical devices; Resonant frequency; Silicon; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium (FCS), 2012 IEEE International
Conference_Location
Baltimore, MD
ISSN
1075-6787
Print_ISBN
978-1-4577-1821-2
Type
conf
DOI
10.1109/FCS.2012.6243682
Filename
6243682
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