• DocumentCode
    2659419
  • Title

    CMOS-compatible light emission device based on thin aluminum nitride film containing Al nanocrystals

  • Author

    Liu, Y. ; Chen, T.P. ; Yang, M. ; Liu, Z. ; Ding, L. ; Zhang, S. ; Li, Y.B.

  • Author_Institution
    Nanyang Technol. Univ., Singapore
  • fYear
    2007
  • fDate
    12-14 Dec. 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Aluminum nitride (AlN) films have attractive physical properties, such as wide bandgap (6.2 eV), high thermal conductivity (320 W/mK), and good match of both thermal expansion coefficient and lattice constant to those of Si substrate . Based on these properties, AlN films can be applied in surface acoustic wave (SAW) devices, memories devices, and optoelectronic devices. It has been reported in our recent studies that amorphous AlN thin films containing aluminum nanocrystals (nc-Al) deposited on Si substrate by radio-frequency (rf) magnetron sputtering possess memory effect and exhibit interesting current conduction behaviors.
  • Keywords
    CMOS integrated circuits; aluminium compounds; lattice constants; light emitting devices; nanostructured materials; sputtering; thermal conductivity; thermal expansion; AlN-Al; CMOS-compatible light emission device; Si; aluminium nanocrystals; aluminum nanocrystals deposition; aluminum nitride films; electron volt energy 6.2 eV; high thermal conductivity; lattice constant; memories devices; memory effect; optoelectronic devices; radio-frequency magnetron sputtering; surface acoustic wave devices; thermal expansion coefficient; thin aluminum nitride film; Aluminum nitride; Conductive films; Lattices; Nanocrystals; Photonic band gap; Semiconductor films; Sputtering; Substrates; Thermal conductivity; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2007 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4244-1892-3
  • Electronic_ISBN
    978-1-4244-1892-3
  • Type

    conf

  • DOI
    10.1109/ISDRS.2007.4422405
  • Filename
    4422405