DocumentCode
2659542
Title
3D structure simulation and proceeding to extract mobility parameters for FinFETs varying channel length
Author
Conde, J.E. ; Cerdeira, A.
Author_Institution
Dept. of Electr. Eng., CINVESTAV, Mexico City, Mexico
fYear
2010
fDate
8-10 Sept. 2010
Firstpage
591
Lastpage
594
Abstract
In this paper we present the 3D trapezoidal structure for analyzing FinFET MOSFETs using three different mesh regions, one at the top and two in the sidewalls of the fin, which allows the consideration of different carrier mobility at each region due to crystalline orientation and technological processing. A procedure for the extraction of the mobility parameters in each region is developed. Validation of the proposed structure was made with one FinFET´s array (with fixed fin width and varying channel length). A very good agreement is obtained between experimental and simulated characteristics.
Keywords
MOSFET; carrier mobility; 3D structure simulation; 3D trapezoidal structure; FinFET MOSFET; FinFET varying channel length; carrier mobility; crystalline orientation; extract mobility parameter; technological processing; Analytical models; Data models; FinFETs; Logic gates; Solid modeling; Three dimensional displays; 3D simulation; FinFET modeling; FinFET simulation; double-gate modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Engineering Computing Science and Automatic Control (CCE), 2010 7th International Conference on
Conference_Location
Tuxtla Gutierrez
Print_ISBN
978-1-4244-7312-0
Type
conf
DOI
10.1109/ICEEE.2010.5608619
Filename
5608619
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