Title :
Bulk GaN-Based Schottky rectifier and UV photodetector
Author :
Park, Mirang ; Zhou, Yangzhong ; Ahyi, C. ; Wang, Dongping ; Tin, C.C. ; Williams, N.M. ; Hanser, A.D. ; Preble, E.A. ; Evans, Kim
Author_Institution :
Auburn Univ., Auburn
Abstract :
High power switches are indispensable components in electronic subsystems for applications such as advanced hybrid electric vehicles. Due to its unipolar nature, a Schottky diode does not exhibit the minority carrier storage effect, and the device has a negligible reverse current transient. Therefore, faster switching can be achieved with Schottky diodes compared to p-n junction diodes. The successful application of Schottky diodes for power rectification also requires efficient thermal management. In this regard, GaN offers an additional advantage due to its relatively high thermal conductivity (compared to Si). A major disadvantage of sapphire substrates that are widely used for epitaxial growth is the poor thermal conductivity (0.5W/cm-K) which limits high current conduction. Recent studies have shown that high quality, low dislocation density, bulk GaN substrates have a relatively high thermal conductivity of 2.3W/cm-K. Furthermore, it is expected that the bulk GaN substrate allows vertical device geometries with a full backside ohmic contact for much higher current conduction compared to lateral rectifiers fabricated on insulating substrates.
Keywords :
III-V semiconductors; Schottky diodes; gallium compounds; p-n junctions; photodetectors; thermal conductivity; ultraviolet detectors; wide band gap semiconductors; GaN; Schottky diode; Schottky rectifier; UV photodetector; high current conduction; minority carrier storage effect; p-n junction diodes; power rectification; power switches; reverse current transient; thermal conductivity; thermal management; Energy management; Gallium nitride; Hybrid electric vehicles; P-n junctions; Photodetectors; Rectifiers; Schottky diodes; Substrates; Thermal conductivity; Thermal management;
Conference_Titel :
Semiconductor Device Research Symposium, 2007 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-1892-3
Electronic_ISBN :
978-1-4244-1892-3
DOI :
10.1109/ISDRS.2007.4422435