Title :
The commercial realization of multi-chip modules quo vadimus
Author_Institution :
Multi-Chip Integrated Packaging, Inc., Summit, NJ, USA
Abstract :
Multi-chip modules (MCMs) have the potential to lead the semiconductor industry to the next level of functional integration. The design, implementation and successful realization of commercially viable modules are still elusive. Factors affecting the commercial viability of this technology are discussed. These factors include design and modeling, substrate fabrication, testing of substrates and modules, and assembly of MCM modules
Keywords :
integrated circuit technology; modules; packaging; assembly; commercial viability; functional integration; multi-chip modules; substrate fabrication; testing; Ceramics; Costs; Delay; Gallium arsenide; Packaging; Semiconductor materials; Semiconductor process modeling; Silicon; Substrates; Timing;
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1991. ICCD '91. Proceedings, 1991 IEEE International Conference on
Conference_Location :
Cambridge, MA
Print_ISBN :
0-8186-2270-9
DOI :
10.1109/ICCD.1991.139982
