DocumentCode
2659999
Title
The commercial realization of multi-chip modules quo vadimus
Author
Hendel, Rudi
Author_Institution
Multi-Chip Integrated Packaging, Inc., Summit, NJ, USA
fYear
1991
fDate
14-16 Oct 1991
Firstpage
601
Lastpage
605
Abstract
Multi-chip modules (MCMs) have the potential to lead the semiconductor industry to the next level of functional integration. The design, implementation and successful realization of commercially viable modules are still elusive. Factors affecting the commercial viability of this technology are discussed. These factors include design and modeling, substrate fabrication, testing of substrates and modules, and assembly of MCM modules
Keywords
integrated circuit technology; modules; packaging; assembly; commercial viability; functional integration; multi-chip modules; substrate fabrication; testing; Ceramics; Costs; Delay; Gallium arsenide; Packaging; Semiconductor materials; Semiconductor process modeling; Silicon; Substrates; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design: VLSI in Computers and Processors, 1991. ICCD '91. Proceedings, 1991 IEEE International Conference on
Conference_Location
Cambridge, MA
Print_ISBN
0-8186-2270-9
Type
conf
DOI
10.1109/ICCD.1991.139982
Filename
139982
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