DocumentCode
2660072
Title
Miniaturization of angular rate sensor element using bonded quartz tuning fork
Author
Inoue, Takahiro ; Yoshimatsu, Masahiro ; Okazaki, Masanobu
Author_Institution
Nihon Dempa Kogyo Co. Ltd., Saitama, Japan
fYear
2003
fDate
4-8 May 2003
Firstpage
1007
Lastpage
1011
Abstract
We developed an extraordinarily miniaturized quartz tuning fork angular rate sensor element(5.3×0.94×0.24 mm). In order to miniaturize an element without sensitivity degradation, we introduced composite quartz by bonding two monolithic wafers with reversing x axes. Moreover we applied photolithography which achieved fine patterning and excellent productivity. The sensor using the new element accomplished the specifications of angular rate sensor.
Keywords
composite materials; electric sensing devices; microsensors; photolithography; piezoelectric devices; quartz; wafer bonding; SiO2; angular rate sensor element; bonded quartz tuning fork; miniaturized quartz tuning fork; monolithic wafers; photolithography; sensitivity; Ceramics; Degradation; Dielectrics; Electrodes; Force sensors; Lithography; Productivity; Sensor phenomena and characterization; Vibrations; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium and PDA Exhibition Jointly with the 17th European Frequency and Time Forum, 2003. Proceedings of the 2003 IEEE International
ISSN
1075-6787
Print_ISBN
0-7803-7688-9
Type
conf
DOI
10.1109/FREQ.2003.1275228
Filename
1275228
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