• DocumentCode
    2660476
  • Title

    Monocrystalline SiGe for high-performance uncooled thermistor

  • Author

    Wissmar, S.G.E. ; Kolahdouz, M. ; Yamamoto, Y. ; Tillack, B. ; Vieider, C. ; Andersson, J.Y. ; Radamsson, H.H.

  • Author_Institution
    Acreo AB, Kista
  • fYear
    2007
  • fDate
    12-14 Dec. 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We demonstrate a novel monocrystalline high-performance thermistor material based on SiGe quantum well heterostructures. The SiGe/Si quantum wells are grown epitaxially on standard Si [001] substrates. Holes are used as charge carriers utilizing the discontinuities in the valence band structure. By optimizing design parameters such as the barrier height (by variation of the germanium content) and the fermi level Ef (by variation of the quantum well width and doping level) of the material, the layer structure can be tailored. Then a very high temperature coefficient of resistivity (TCR) can be obtained which is superior to the previous reported conventional thin film materials such as vanadium oxide and amorphous silicon. In addition, the high quality crystalline material promises very low 1/f-noise characteristics promoting an outstanding signal to noise ratio as well as well defined and uniform material properties.
  • Keywords
    1/f noise; Ge-Si alloys; crystals; epitaxial growth; thermistors; thin film resistors; valence bands; 1/f-noise characteristics; SiGe quantum well heterostructures; amorphous silicon; design parameters; epitaxial growth; fermi level; germanium content; high-performance uncooled thermistor; monocrystalline SiGe; thin film materials; valence band structure; vanadium oxide; Charge carriers; Conductivity; Crystalline materials; Design optimization; Doping; Germanium silicon alloys; Silicon germanium; Substrates; Temperature; Thermistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2007 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4244-1891-6
  • Electronic_ISBN
    978-1-4244-1892-3
  • Type

    conf

  • DOI
    10.1109/ISDRS.2007.4422465
  • Filename
    4422465