Electrically Injected InGaAsP Microdisk Lasers Heterogeneously Integrated on a Si-Wafer

Author

Van Campenhout, J. ; Rojo-Romeo, P. ; Van Thourhout, Dries ; Seassal, Christian ; Regreny, P. ; Di Cioccio, L. ; Fedeli, J.M. ; Baets, Roel

Author_Institution

Dept. of Inf. Technol., Ghent Univ.

fYear

0

fDate

0-0 0

Firstpage

133

Lastpage

134

Abstract

We report on electrically pumped lasing in microdisk cavities etched in a thin InP-based membrane directly bonded on top of a silicon wafer. The microdisks were planarized by means of a benzocyclobutene (BCB) layer, into which contact windows were etched to perform current injection. The top metal contact is placed only in the centre of the disk, whereas the bottom contacting is done by means of a thin lateral InP contacting layer. In order to avoid large optical absorption in p-type contact layers, a tunnel junction was used in combination with two n-type contacts. Lasing was observed in pulsed regime at room temperature with current thresholds in the range 0.55-1.1 mA, for microdisks with a diameter in the range 6-9 mum

Keywords

III-V semiconductors; elemental semiconductors; gallium arsenide; gallium compounds; indium compounds; laser beams; laser cavity resonators; microdisc lasers; optical interconnections; organic compounds; semiconductor lasers; silicon; 0.55 to 1.1 mA; 6 to 9 micron; InGaAsP; Si; benzocyclobutene layer; current injection; electrically injected microdisk lasers; electrically pumped lasing; heterogeneous integration; microdisk cavities; n-type contacts; optical absorption; optical interconnect; p-type contact layers; semiconductor laser; silicon wafer; thin lateral InP contacting layer; tunnel junction; Absorption; Biomembranes; Contacts; Etching; Indium phosphide; Optical pulses; Optical pumping; Pump lasers; Silicon; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Laser Conference, 2006. Conference Digest. 2006 IEEE 20th International

Conference_Location

Kohala Coast, HI

Print_ISBN

0-7803-9560-3

Type

conf

DOI

10.1109/ISLC.2006.1708122

Filename

1708122