Title :
Smart-power device model coupling compact, distributed and logic level description
Author :
Castellazzi, Alberto ; Ciappa, Mauro
Author_Institution :
Swiss Federal Institute of Technology (ETH Zurich) - Integrated Systems Laboratory, Switzerland
Abstract :
This paper proposes the multi-level-abstraction electro-thermal model of an integrated power device. Thermal aspects are rendered with a distributed 3D description and coupled both with analytical and logic equations. A comparison of measurements and simulation results demonstrates the validity of the chosen approach, based on VHDL-AMS.
Keywords :
Current measurement; Educational institutions; Equations; Integrated circuit measurements; Logic devices; Power system modeling; Semiconductor device measurement; Temperature measurement; Temperature sensors; Thigh;
Conference_Titel :
Semiconductor Device Research Symposium, 2007 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-1892-3
Electronic_ISBN :
978-1-4244-1892-3
DOI :
10.1109/ISDRS.2007.4422478
