DocumentCode
2661015
Title
Nanofiller effect during post-heat treatmentof micro-loaded epoxy
Author
Couderc, H. ; Fréchette, M.F. ; Savoie, S. ; David, E.
Author_Institution
Ecole de Technol. Super. (ETS), Montreal, QC, Canada
fYear
2010
fDate
17-20 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
Samples of epoxy filled with micrometric quartz were prepared with or without the addition of a small amount of nanoclay, in regard to the quartz content. The influence of the nanofiller on heat treatment after curing was characterized using dielectric spectroscopy. It was put in evidence that the addition of nanofillers caused an increase of the relaxation time of the α relaxation process, altered the kinetic of the post-curing and of the water diffusion processes but did not affect the β relaxation rate.
Keywords
curing; dielectric relaxation; diffusion; filled polymers; heat treatment; quartz; resins; SiO2; curing; dielectric spectroscopy; diffusion; microloaded epoxy; micrometric quartz; nanoclay; nanofiller effect; post-heat treatment; relaxation process; Curing; Dielectrics; Fitting; Permittivity; Plastics; Spectroscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2010 Annual Report Conference on
Conference_Location
West Lafayette, IN
ISSN
0084-9162
Print_ISBN
978-1-4244-9468-2
Type
conf
DOI
10.1109/CEIDP.2010.5724103
Filename
5724103
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