DocumentCode
2661297
Title
Organic and carbon-based electronics printed onto flexible substrates
Author
Hines, D.R. ; Southard, A.E. ; Sangwan, V. ; Chen, J.-H. ; Fuhrer, M.S. ; Williams, E.D.
Author_Institution
Univ. of Maryland, College Park
fYear
2007
fDate
12-14 Dec. 2007
Firstpage
1
Lastpage
2
Abstract
In this paper, examples of organic and carbon-based thin-film transistors (TFT) that have been fabricated onto plastic substrates. The fabrication of these devices was achieved using the transfer printing method. With this method, each of the components (Au electrodes, polymer dielectric layer and semiconductor layer) were printed onto a plastic substrate using only pressure and temperature. This constitutes a very simple fabrication process that relies primarily on differential adhesion and eliminates all chemical processing on the device substrate.
Keywords
adhesion; carbon; electronics packaging; flexible electronics; organic semiconductors; printing; thin film transistors; C; adhesion; carbon-based TFT; electrode components; electronics printing; fabrication process; flexible substrates; organic thin-film transistors; plastic substrates; polymer dielectric layer; semiconductor layer; transfer printing method; Adhesives; Dielectric substrates; Electrodes; Fabrication; Gold; Plastics; Polymers; Printing; Temperature; Thin film transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2007 International
Conference_Location
College Park, MD
Print_ISBN
978-1-4244-1892-3
Electronic_ISBN
978-1-4244-1892-3
Type
conf
DOI
10.1109/ISDRS.2007.4422520
Filename
4422520
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