• DocumentCode
    2661297
  • Title

    Organic and carbon-based electronics printed onto flexible substrates

  • Author

    Hines, D.R. ; Southard, A.E. ; Sangwan, V. ; Chen, J.-H. ; Fuhrer, M.S. ; Williams, E.D.

  • Author_Institution
    Univ. of Maryland, College Park
  • fYear
    2007
  • fDate
    12-14 Dec. 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this paper, examples of organic and carbon-based thin-film transistors (TFT) that have been fabricated onto plastic substrates. The fabrication of these devices was achieved using the transfer printing method. With this method, each of the components (Au electrodes, polymer dielectric layer and semiconductor layer) were printed onto a plastic substrate using only pressure and temperature. This constitutes a very simple fabrication process that relies primarily on differential adhesion and eliminates all chemical processing on the device substrate.
  • Keywords
    adhesion; carbon; electronics packaging; flexible electronics; organic semiconductors; printing; thin film transistors; C; adhesion; carbon-based TFT; electrode components; electronics printing; fabrication process; flexible substrates; organic thin-film transistors; plastic substrates; polymer dielectric layer; semiconductor layer; transfer printing method; Adhesives; Dielectric substrates; Electrodes; Fabrication; Gold; Plastics; Polymers; Printing; Temperature; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2007 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4244-1892-3
  • Electronic_ISBN
    978-1-4244-1892-3
  • Type

    conf

  • DOI
    10.1109/ISDRS.2007.4422520
  • Filename
    4422520