• DocumentCode
    2661546
  • Title

    Vertically-Stacked SOI Waveguides for 3-D Photonic Circuits

  • Author

    Brooks, C.J. ; Doylend, J.K. ; Knights, A.P. ; Jessop, P.E.

  • Author_Institution
    Dept. of Eng. Phys., McMaster Univ., Hamilton, Ont.
  • fYear
    2006
  • fDate
    13-15 Sept. 2006
  • Firstpage
    72
  • Lastpage
    74
  • Abstract
    We present a fabrication process for vertically-stacked SOI waveguides using spin-on-glass bonding to process individual layers. Simulations have shown that complete power transfer between 5 mum thick waveguides requires a 1.4 mm coupling length
  • Keywords
    integrated circuit bonding; integrated optics; integrated optoelectronics; optical fabrication; optical waveguides; silicon-on-insulator; 1.4 mm; 3-D photonic circuits; 5 micron; Si-SiO2; coupling length; fabrication process; power transfer; spin-on-glass bonding; vertically-stacked SOI waveguides; Coupling circuits; Etching; Geometrical optics; Optical coupling; Optical device fabrication; Optical waveguides; Semiconductor waveguides; Silicon; Slabs; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics, 2006. 3rd IEEE International Conference on
  • Conference_Location
    Ottawa, Ont.
  • Print_ISBN
    1-4244-0096-1
  • Type

    conf

  • DOI
    10.1109/GROUP4.2006.1708169
  • Filename
    1708169
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2661546