Title :
Vertically-Stacked SOI Waveguides for 3-D Photonic Circuits
Author :
Brooks, C.J. ; Doylend, J.K. ; Knights, A.P. ; Jessop, P.E.
Author_Institution :
Dept. of Eng. Phys., McMaster Univ., Hamilton, Ont.
Abstract :
We present a fabrication process for vertically-stacked SOI waveguides using spin-on-glass bonding to process individual layers. Simulations have shown that complete power transfer between 5 mum thick waveguides requires a 1.4 mm coupling length
Keywords :
integrated circuit bonding; integrated optics; integrated optoelectronics; optical fabrication; optical waveguides; silicon-on-insulator; 1.4 mm; 3-D photonic circuits; 5 micron; Si-SiO2; coupling length; fabrication process; power transfer; spin-on-glass bonding; vertically-stacked SOI waveguides; Coupling circuits; Etching; Geometrical optics; Optical coupling; Optical device fabrication; Optical waveguides; Semiconductor waveguides; Silicon; Slabs; Wafer bonding;
Conference_Titel :
Group IV Photonics, 2006. 3rd IEEE International Conference on
Conference_Location :
Ottawa, Ont.
Print_ISBN :
1-4244-0096-1
DOI :
10.1109/GROUP4.2006.1708169
