• DocumentCode
    2661639
  • Title

    Analytical Modeling of Semiconductor Losses in Matrix Converters

  • Author

    Wang, Bingsen ; Venkataramanan, Giri

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI
  • Volume
    1
  • fYear
    2006
  • fDate
    14-16 Aug. 2006
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Analytical models for estimating semiconductor losses are commonly used for heatsink selection in the design process of power converters. While such models are established and widely known for different DC-DC converters, rectifiers and inverters, they have not been developed for matrix converters. Therefore, one has to resort to the use of numerical simulation for this purpose. Although numerical simulation is a straightforward approach as long as the power switching devices are properly modeled, it is typically time consuming and requires accurate physical models for the device. In this paper, an analytical approach to characterizing the semiconductor losses of the conventional matrix converter (CMC) and the indirect matrix converter (IMC) is presented. The analytical results are verified against the simulation results from a detailed numerical model under a wide variety of operating conditions
  • Keywords
    losses; matrix convertors; numerical analysis; power semiconductor devices; heatsink selection; matrix converter; numerical simulation; power converter; power switching devices; semiconductor losses; Analytical models; Insulated gate bipolar transistors; Matrix converters; Numerical simulation; Power semiconductor switches; Predictive models; Switching converters; Switching loss; Topology; Voltage; conduction loss; conventional matrix converter (CMC); indirect matrix converter (IMC); simulation; switching loss;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Motion Control Conference, 2006. IPEMC 2006. CES/IEEE 5th International
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0448-7
  • Type

    conf

  • DOI
    10.1109/IPEMC.2006.4777987
  • Filename
    4777987