DocumentCode
2661671
Title
Smart-power device model coupling compact, distributed and logic level description
Author
Castellazzi, Alberto ; Ciappa, Mauro
Author_Institution
Swiss Fed. Inst. of Technol., Zurich
fYear
2007
fDate
12-14 Dec. 2007
Firstpage
1
Lastpage
2
Abstract
This paper proposes the multi-level-abstraction electro-thermal model of an integrated power device. Thermal aspects are rendered with a distributed 3D description and coupled both with analytical and logic equations. A comparison of measurements and simulation results demonstrates the validity of the chosen approach, based on VHDL-AMS.
Keywords
hardware description languages; integrated logic circuits; power integrated circuits; VHDL-AMS; analytical equation; distributed 3D description; hardware description languages; integrated power device; logic equation; logic level description; multilevel-abstraction electro-thermal model; smart-power device model; Current measurement; Educational institutions; Equations; Integrated circuit measurements; Logic devices; Power system modeling; Semiconductor device measurement; Temperature measurement; Temperature sensors; Thigh;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2007 International
Conference_Location
College Park, MD
Print_ISBN
978-1-4244-1892-3
Electronic_ISBN
978-1-4244-1892-3
Type
conf
DOI
10.1109/ISDRS.2007.4422542
Filename
4422542
Link To Document