DocumentCode :
2661930
Title :
Thick GaN layer grown by Ga vapor transport technique
Author :
Wu, Huaqiang ; Konkapaka, Phanikumar ; Makarov, Yuri ; Spencer, Michael G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
fYear :
2004
fDate :
4-6 Aug. 2004
Firstpage :
121
Lastpage :
125
Abstract :
Using a novel Ga vapor transport technique, thick gallium nitride layers have been deposited on a 3-6 μm GaN film grown on sapphire substrate via hydride vapor phase epitaxy (HVPE). GaN powder was successfully used as a stable Ga source material for the growth. A growth rate of greater than 200 μm/hr was achieved by optimizing the growth temperature and the reactant gas flow rates. This growth rate is as high as that achieved by HVPE. The GaN layers were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM).
Keywords :
III-V semiconductors; X-ray diffraction; atomic force microscopy; gallium compounds; sapphire; scanning electron microscopy; semiconductor epitaxial layers; substrates; vapour phase epitaxial growth; wide band gap semiconductors; 3 to 6 micron; Al2O3; GaN; X-ray diffraction; atomic force microscopy; growth temperature; hydride vapor phase epitaxy; reactant gas flow rates; sapphire substrate; scanning electron microscopy; thick gallium nitride layers; vapor transport technique; Atomic force microscopy; Epitaxial growth; Fluid flow; Gallium nitride; III-V semiconductor materials; Powders; Scanning electron microscopy; Substrates; Temperature; X-ray diffraction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Performance Devices, 2004. Proceedings. IEEE Lester Eastman Conference on
Print_ISBN :
981-256-196-X
Type :
conf
DOI :
10.1109/LECHPD.2004.1549682
Filename :
1549682
Link To Document :
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