Title :
Concept for an Alternative Solder-Free Flip-Chip Technique on SOI using Black-Silicon
Author :
Schnarrenberger, M. ; Zimmermann, L. ; Mitze, T. ; Voigt, K. ; Bruns, J. ; Petermann, K.
Author_Institution :
Technische Univ. Berlin
Abstract :
Black-silicon regions are defined on an SOI board and covered with an adhesion layer. The contacts of to be mounted devices are pushed towards these regions, to establish a mechanical, electrical, and thermal contact
Keywords :
electrical contacts; electronics packaging; flip-chip devices; integrated optoelectronics; mechanical contact; semiconductor lasers; silicon; silicon-on-insulator; SOI; Si-SiO2; adhesion layer; black-silicon regions; electrical contact; laser contact; mechanical contact; solder-free flip-chip technique; thermal contact; Bonding; Contacts; Dry etching; Electronic packaging thermal management; Gold; Manufacturing processes; Optical waveguides; Silicon; Surface emitting lasers; Waveguide lasers;
Conference_Titel :
Group IV Photonics, 2006. 3rd IEEE International Conference on
Conference_Location :
Ottawa, Ont.
Print_ISBN :
1-4244-0096-1
DOI :
10.1109/GROUP4.2006.1708209
