• DocumentCode
    2662222
  • Title

    Concept for an Alternative Solder-Free Flip-Chip Technique on SOI using Black-Silicon

  • Author

    Schnarrenberger, M. ; Zimmermann, L. ; Mitze, T. ; Voigt, K. ; Bruns, J. ; Petermann, K.

  • Author_Institution
    Technische Univ. Berlin
  • fYear
    2006
  • fDate
    13-15 Sept. 2006
  • Firstpage
    191
  • Lastpage
    193
  • Abstract
    Black-silicon regions are defined on an SOI board and covered with an adhesion layer. The contacts of to be mounted devices are pushed towards these regions, to establish a mechanical, electrical, and thermal contact
  • Keywords
    electrical contacts; electronics packaging; flip-chip devices; integrated optoelectronics; mechanical contact; semiconductor lasers; silicon; silicon-on-insulator; SOI; Si-SiO2; adhesion layer; black-silicon regions; electrical contact; laser contact; mechanical contact; solder-free flip-chip technique; thermal contact; Bonding; Contacts; Dry etching; Electronic packaging thermal management; Gold; Manufacturing processes; Optical waveguides; Silicon; Surface emitting lasers; Waveguide lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics, 2006. 3rd IEEE International Conference on
  • Conference_Location
    Ottawa, Ont.
  • Print_ISBN
    1-4244-0096-1
  • Type

    conf

  • DOI
    10.1109/GROUP4.2006.1708209
  • Filename
    1708209
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2662222