Title :
A New Approach to Produce Cost-effective Known Good Die
Author :
Kim, I.U. ; Lee, S.H. ; Hyun, I.H. ; Lee, K.J. ; Park, J.M.
Author_Institution :
Samsung Electronics, Korea
Keywords :
Bonding; Circuit testing; Costs; Data engineering; Electronics industry; Gold; Mass production; Printed circuits; Reliability engineering; Wire;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753522
