DocumentCode

2662513

Title

A New Approach to Produce Cost-effective Known Good Die

Author

Kim, I.U. ; Lee, S.H. ; Hyun, I.H. ; Lee, K.J. ; Park, J.M.

Author_Institution

Samsung Electronics, Korea

fYear

1994

fDate

13-15 Apr 1994

Firstpage

7

Lastpage

15

Keywords

Bonding; Circuit testing; Costs; Data engineering; Electronics industry; Gold; Mass production; Printed circuits; Reliability engineering; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753522

Filename

753522