Title :
Implementing a Tab Tape-based Known Good Die Method
Author :
Salatino, Matthew ; Nolan, Rick ; Bishop, Thom ; Bieber, Chuck
Author_Institution :
Microelectronics and Computer Technology Corporation (MCC) Austin, TX
Keywords :
Aerospace electronics; Aircraft; Bonding forces; Costs; Flip chip; Lead; Microelectronics; Packaging; Production; Testing;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753523
