Title :
Comparison of Two Temporary Carriers for Test and Burn-In of Memory Die
Author :
Lindsey, Scott ; Williams, Bill ; Vasquez, Barbara ; Altuna, Bob ; VanOverloop, Don ; Walker, Scott
Author_Institution :
Motorola, Semiconductor Products Sector, Austin, TX
Keywords :
Aluminum; Bonding; Burnishing; Contacts; Costs; Fixtures; Power system interconnection; Probes; Random access memory; Testing;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753525
