DocumentCode

2662601

Title

A Cost-Effective Wafer-Level Burn-In Technology

Author

Tuckerman, David B. ; Jarvis, Bruce ; Lin, Chang-Ming ; Patel, Pradip ; Hunt, Michael

Author_Institution

nCHIP, Inc., CA

fYear

1994

fDate

13-15 Apr 1994

Firstpage

34

Lastpage

40

Keywords

Costs; Fixtures; Isolation technology; Manufacturing; Probes; Resistors; Silicon; Temperature; Thermal expansion; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753526

Filename

753526