Title :
A Cost-Effective Wafer-Level Burn-In Technology
Author :
Tuckerman, David B. ; Jarvis, Bruce ; Lin, Chang-Ming ; Patel, Pradip ; Hunt, Michael
Author_Institution :
nCHIP, Inc., CA
Keywords :
Costs; Fixtures; Isolation technology; Manufacturing; Probes; Resistors; Silicon; Temperature; Thermal expansion; Wafer bonding;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753526
