Title :
Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections
Author :
Adema, Gretchen M. ; Berry, Christopher J. ; Koopman, Nicholas G. ; Rinne, Glenn A. ; Yung, Edward K. ; Turlik, Iwona
Author_Institution :
University of North Carolina at Charlotte
Keywords :
Assembly; Cleaning; Costs; Flip chip; Multichip modules; Passivation; Polyimides; Sputter etching; Testing; Wet etching;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753527
