Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections

Author

Adema, Gretchen M. ; Berry, Christopher J. ; Koopman, Nicholas G. ; Rinne, Glenn A. ; Yung, Edward K. ; Turlik, Iwona

Author_Institution

University of North Carolina at Charlotte

fYear

1994

fDate

13-15 Apr 1994

Firstpage

Lastpage

Keywords

Assembly; Cleaning; Costs; Flip chip; Multichip modules; Passivation; Polyimides; Sputter etching; Testing; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

DOI

10.1109/ICMCM.1994.753527

Filename

753527

Link To Document