DocumentCode

2662622

Title

Fine Pitch Wedge Bonding for High Density Packaging

Author

Short, Roland

Author_Institution

Unisys Corporation, CA

fYear

1994

fDate

13-15 Apr 1994

Firstpage

50

Lastpage

55

Keywords

Aluminum; Assembly; Bonding; Electronics packaging; Glass; Microassembly; Packaging machines; Silver; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753528

Filename

753528