Title :
Fine Pitch Wedge Bonding for High Density Packaging
Author_Institution :
Unisys Corporation, CA
Keywords :
Aluminum; Assembly; Bonding; Electronics packaging; Glass; Microassembly; Packaging machines; Silver; Testing; Wire;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753528