DocumentCode :
2662622
Title :
Fine Pitch Wedge Bonding for High Density Packaging
Author :
Short, Roland
Author_Institution :
Unisys Corporation, CA
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
50
Lastpage :
55
Keywords :
Aluminum; Assembly; Bonding; Electronics packaging; Glass; Microassembly; Packaging machines; Silver; Testing; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753528
Filename :
753528
Link To Document :
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