Title :
Thermoplastic Die Attach for Hermetic Packaging
Author :
Harper, Peter R.
Author_Institution :
Advanced Packaging Assembly and Manufacturing, Austin, Texas
Keywords :
Bonding; Ceramics; Electronic packaging thermal management; Glass; Gold; Microassembly; Polymers; Semiconductor device packaging; Silicon; Temperature;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753529
