Title :
Rework of Wire Bonded Devices on Mcms
Author :
Proietti-Bowne, Camille ; Elenius, Peter
Author_Institution :
IBM Microelectronics Division, NY
Keywords :
Atherosclerosis; Bonding; Cost function; Microassembly; Microelectronics; Process control; Production; Thin film devices; Wire; Wiring;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753530
