Title :
Implementation of Advanced Micro-Interconnection Technologies on a Thin-Film Multichip Module
Author :
Interrante, M.J. ; Clearfield, H.M. ; Beckham, K.F. ; Economikos, L.
Author_Institution :
IBM Federal Systems Company, NY
Keywords :
Bonding forces; Dielectric substrates; Fiber lasers; Flip chip; Lead; Multichip modules; Power lasers; Testing; Transistors; Wire;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753531
