Title :
Cost Implications of Large Area MCM Processing
Author :
Frye, Donald C. ; Skinner, Michael P. ; Heistand, Robert H., II ; Garrou, Philip E. ; Tessier, T.G.
Author_Institution :
The Dow Chemical Company, NC
Keywords :
Chemical processes; Coatings; Conducting materials; Costs; Dielectric materials; Dielectric substrates; Dielectric thin films; Fabrication; Flat panel displays; Sensitivity analysis;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753532
