Title :
A sub-surface metallization post-process IC module for RF technology
Author :
Ng, Kiat T. ; Pham, Nga P. ; Rejaei, Behzad ; Sarro, Pasqualina M. ; Burghartz, Joachim N.
Author_Institution :
Lab. of Electron. Components, Technol. & Mater, Delft Univ. of Technol., Netherlands
Abstract :
A novel post-process bulk-micromachining module for sub-surface metallization is presented. The module provides an integrated radio-frequency (RF) ground plane at sufficient distance beneath the wafer surface and a frontside contact to that ground plane to integrate conductor-backed inductors and microstrips, as well as a trench structure for crosstalk suppression in RF circuits
Keywords :
MMIC; crosstalk; electrical contacts; inductors; integrated circuit measurement; integrated circuit metallisation; interference suppression; isolation technology; micromachining; microstrip lines; RF circuits; RF technology; conductor-backed inductor integration; conductor-backed microstrip integration; crosstalk suppression; frontside contact; ground plane; integrated RF ground plane; integrated radio-frequency ground plane; post-process bulk-micromachining module; sub-surface metallization; sub-surface metallization post-process IC module; trench structure; wafer surface; Contacts; Crosstalk; Inductors; Metallization; Microstrip; Radio frequency; Radiofrequency integrated circuits; Silicon; Spirals; Testing;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 2000. Proceedings of the 2000
Conference_Location :
Minneapolis, MN
Print_ISBN :
0-7803-6384-1
DOI :
10.1109/BIPOL.2000.886203
