Title :
Large Format Mcm-D Processing Adaptation of the Hughes HdmiTM Process to Large Format Mcm-D: Options, Problems, Results to Date
Author :
Trask, Philip A. ; Pillai, Vincent A.
Author_Institution :
Semiconductor Products Center (SPC), CA
Keywords :
Bonding; Cost function; Gold; Manufacturing processes; Packaging; Production; Prototypes; Silicon; Substrates; Wire;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753535
