Title :
Thin Film Transfer Process for Low Cost Mcm-D Fabrication
Author :
Narayan, C. ; Purushothaman, S. ; Doany, F. ; Deutsch, A.
Author_Institution :
T.J. Watson Research Center, NY
Keywords :
Costs; Fabrication; Flexible manufacturing systems; Glass; Packaging; Polymer films; Pulp manufacturing; Substrates; Transistors; Wiring;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753537
