DocumentCode :
2662768
Title :
Cu/Photosensitive-BCB Thin-Film Multilayer Technology for High-Performance Multichip Module
Author :
Shimoto, Tadanori ; Matsui, Koji ; Utsumi, Kazuaki
Author_Institution :
Material Development Center, NEC Corporation, Japan
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
115
Lastpage :
120
Keywords :
Adhesives; Conductors; Costs; Fabrication; Multichip modules; Nonhomogeneous media; Prototypes; Reduced instruction set computing; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753538
Filename :
753538
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2662768
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