Title :
The TCC/MCM: μBGA on a laminated substrate
Author :
Martinez, Marcelo ; Gibson, David ; Matthew, Linda ; DiStefano, Thomas ; Cofield, John
Author_Institution :
Tessera, Inc., CA
Keywords :
Assembly; Costs; Crosstalk; Drives; Electronics packaging; Graphics; Lamination; Process control; Surface-mount technology; Testing;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753545
