2662864

An Application Strategy for Scm-L and Mcm-L Using High Density Laminate Technologies

Houston, T. ; Heck, H. ; Knight, J.

IBM Microelectronics, NY

1994

13-15 Apr 1994

167

172

Costs; Electronic packaging thermal management; Electronics industry; Electronics packaging; Flip chip; Laminates; Material properties; Microelectronics; Space technology; Wiring;

English

ieee

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

0-930815-39-4

conf

10.1109/ICMCM.1994.753546

753546