• DocumentCode
    2662864
  • Title

    An Application Strategy for Scm-L and Mcm-L Using High Density Laminate Technologies

  • Author

    Houston, T. ; Heck, H. ; Knight, J.

  • Author_Institution
    IBM Microelectronics, NY
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    167
  • Lastpage
    172
  • Keywords
    Costs; Electronic packaging thermal management; Electronics industry; Electronics packaging; Flip chip; Laminates; Material properties; Microelectronics; Space technology; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753546
  • Filename
    753546
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2662864