Title :
Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Author :
Linz, Torsten ; Kallmayer, Christine ; Aschenbrenner, Rolf ; Reichl, Herbert
Author_Institution :
Fraunhofer IZM, Berlin, Germany
Abstract :
This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.
Keywords :
fabrics; intelligent materials; moulding; textile products; yarn; conductive yarn; electrical interconnect embroidering; fabric; flexible electronic modules; mold encapsulation; Circuit testing; Consumer electronics; Contacts; Fabrics; Flexible electronics; Flip chip; Integrated circuit interconnections; Textile technology; Wearable computers; Yarn;
Conference_Titel :
Wearable Computers, 2005. Proceedings. Ninth IEEE International Symposium on
Print_ISBN :
0-7695-2419-2
DOI :
10.1109/ISWC.2005.19