DocumentCode :
2662922
Title :
Interconnected Mesh Power System, (IMPS) A Packaging and Interconnection Application
Author :
Reynolds, Carl V. ; Schaper, Leonard W.
Author_Institution :
High Density Electronics Center, University of Arkansas
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
188
Lastpage :
192
Keywords :
Availability; Costs; Electronics packaging; Impedance; Industrial power systems; Integrated circuit interconnections; Manufacturing; Power system interconnection; Power system reliability; Topology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753549
Filename :
753549
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2662922
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