Title :
Testing Multichip Modules and Bare Die Using Vision Probing Techniques
Author_Institution :
KARL SUSS AMERICA, VT
Keywords :
Automatic testing; Circuit testing; Costs; Machine vision; Multichip modules; Optical sensors; Performance evaluation; Probes; Semiconductor device manufacture; System testing;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753553
