Title : 
Dielectric properties of polystyrene based composites filled with core-shell BaTiO3/polystyrene hybrid nanoparticles
         
        
            Author : 
Wang, Dongping ; Huang, Meng ; Zha, Jun-Wei ; Zhao, Junhua ; Dang, Zhi-Min ; Cheng, Zhongyuan
         
        
            Author_Institution : 
Department of Polymer Science and Engineering, School of Chemistry and Biological Engineering University of Science and Technology Beijing Beijing, 100083, China
         
        
        
        
        
        
        
        
            Abstract : 
In this work, core-shell structured BaTiO3/polystyrene nanoparticles (BT-PS) with different thickness of PS shell were synthesized through atom transfer radical polymerization and the influence of their shell thickness on dielectric properties of BTPS/ PS composites was studied. Two types of BT-PS with the PS shell of 3 nm or 12 nm were obtained by controlling the polymerization time. The structure of BT-PS was carefully characterized by infrared spectroscopy, X-ray diffraction, thermal gravimetric analysis, and transmission electron microscope. The results confirmed the successful preparation of core-shell BT-PS nanoparticles. Compared to pristine BT, the core-shell particles can be more homogeneously dispersed into PS matrix. As a result, higher dielectric constant, higher breakdown strength, and lower dielectric loss were achieved in BT-PS/PS composites. Moreover, the dielectric constant of BT-PS/PS composites displayed frequency independent behavior. In addition, the composites filled by BT-PS with 3 nm of PS shell showed better dielectric properties than those filled by BT-PS with 12 nm of PS shell. A maximum energy density as large as 4.24 J/cm3 was obtained in BT-PS/PS films.
         
        
            Keywords : 
Ceramics; Dielectric constant; Dielectric losses; Nanoparticles; Permittivity; Polymers; Dielectric properties; composite; core-shell structure; energy density; polystryrene.;
         
        
        
            Journal_Title : 
Dielectrics and Electrical Insulation, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TDEI.2013.004329