DocumentCode
2663023
Title
Mcm Burn-In Experience
Author
Bardsley, Tom ; Lisowski, Joe ; Wilson, Steve ; VanAernam, Steve
Author_Institution
IBM Microelectronics
fYear
1994
fDate
13-15 Apr 1994
Firstpage
223
Lastpage
229
Keywords
CMOS process; CMOS technology; Computer aided manufacturing; Electrical stimulation; Microelectronics; Packaging; Substrates; Testing; Thermal management; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753555
Filename
753555
Link To Document