مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2663023

Title :

Mcm Burn-In Experience

Author :

Bardsley, Tom ; Lisowski, Joe ; Wilson, Steve ; VanAernam, Steve

Author_Institution :

IBM Microelectronics

fYear :

1994

fDate :

13-15 Apr 1994

Firstpage :

223

Lastpage :

229

Keywords :

CMOS process; CMOS technology; Computer aided manufacturing; Electrical stimulation; Microelectronics; Packaging; Substrates; Testing; Thermal management; Thermal stresses;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN :

0-930815-39-4

Type :

conf

DOI :

10.1109/ICMCM.1994.753555

Filename :

753555

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663023