DocumentCode :
2663031
Title :
The LIGA technique and its potential for microsystems
Author :
Bacher, W. ; Menz, W. ; Mohr, J.
Author_Institution :
Inst. fur Mikrostrukturtech., Kernforschungszentrum Karlsruhe, Germany
Volume :
3
fYear :
1994
fDate :
5-9 Sep 1994
Firstpage :
1466
Abstract :
The LIGA technique, which is an X-ray lithographic electrodeposition molding process, was developed at the Nuclear Research Centre Karlsruhe. Unlike in the silicon-based technology, the source material is an X-ray sensitive plastic layer of several hundred micrometers thickness which is directly polymerized onto a metallic base plate. The pattern of a mask is transferred into the thick resist layer by means of highly parallel, high intensity synchrotron radiation at a characteristic wavelength of 0.2 to 0.6 nm. Due to breakage in the long chains of molecules the irradiated areas change their chemical stability and can be dissolved with a suitable developer. Techniques involving microelectrodeposition can be used to build up a complementary structure of metal. With the metal structure so generated, almost any number of copies made of plastic can be reproduced with a high accuracy in detail and at relatively little cost using injection molding, reaction injection molding or embossing techniques
Keywords :
X-ray lithography; X-ray masks; electrodeposition; micromachining; micromechanical devices; micromotors; micropumps; 0.2 to 0.6 nm; LIGA technique; Nuclear Research Centre Karlsruhe; X-ray lithographic electrodeposition molding; X-ray sensitive plastic layer; masking; metallic base plate; microelectrodeposition; micropump; microsystems; microturbines; plastic injection molding; polymerization; Chemicals; Costs; Injection molding; Inorganic materials; Plastics; Polymers; Resists; Stability; Synchrotron radiation; X-ray lithography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, Control and Instrumentation, 1994. IECON '94., 20th International Conference on
Conference_Location :
Bologna
Print_ISBN :
0-7803-1328-3
Type :
conf
DOI :
10.1109/IECON.1994.398030
Filename :
398030
Link To Document :
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