Title :
Defect Migration of Multi-chip Modules Using Structural Test
Author :
Eastman, Jed ; Creighton, IVilliam ; Laidler, Andrew ; Leung, Tak
Author_Institution :
IBM Corporation, Poughkeepsie, NY
Keywords :
Automatic testing; Bonding; Built-in self-test; Circuit testing; Continuous improvement; Continuous production; Heat sinks; Logic arrays; Packaging; System testing;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753556
