• DocumentCode
    2663032
  • Title

    Defect Migration of Multi-chip Modules Using Structural Test

  • Author

    Eastman, Jed ; Creighton, IVilliam ; Laidler, Andrew ; Leung, Tak

  • Author_Institution
    IBM Corporation, Poughkeepsie, NY
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    230
  • Lastpage
    241
  • Keywords
    Automatic testing; Bonding; Built-in self-test; Circuit testing; Continuous improvement; Continuous production; Heat sinks; Logic arrays; Packaging; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753556
  • Filename
    753556
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663032