Title :
High Performance Elastic Connection for Reliable Device Testing
Author :
Hiwada, Kiyoyasu ; Tamura, Takeshi
Author_Institution :
Yokogawa Hewlett Packard, Ltd., Japan
Keywords :
Biomembranes; Circuit testing; Contacts; Frequency; High speed integrated circuits; Isolation technology; Packaging; Rubber; Shape; Silicon;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753557
