Title :
On Wafer Burn-in Strategies for MCM Die
Author_Institution :
Auburn University, AL
Keywords :
Automatic testing; Built-in self-test; Circuit faults; Clocks; Contacts; Costs; Manufacturing; Packaging; Thermal management; Thermal stresses;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753559
