DocumentCode

2663070

Title

On Wafer Burn-in Strategies for MCM Die

Author

Singh, Adit D.

Author_Institution

Auburn University, AL

fYear

1994

fDate

13-15 Apr 1994

Firstpage

255

Lastpage

260

Keywords

Automatic testing; Built-in self-test; Circuit faults; Clocks; Contacts; Costs; Manufacturing; Packaging; Thermal management; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753559

Filename

753559