Title :
Known Good Die Selection Tradeoffs: A Cost Model
Author :
Murphy, Cynthia F.
Author_Institution :
Microelectronics and Computer Technology Corporation, TX
Keywords :
Assembly; Costs; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit testing; Microelectronics; Packaging machines; Plastic packaging; Semiconductor device modeling; Sockets;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753560
